Embedd

London-based Physical AI developer platform Embedd has secured a $2.7 million (£2.0 million / €2.31 million) Pre-Seed funding round led by European seed benchmark investor Seedcamp.

Summary of transaction details:

• Value: $2.7 million (£2.0 million / €2.31 million) Pre-Seed capital.
• Sector: DeepTech & AI / Physical AI / Semiconductor DevTools.
• Advisor: Not disclosed.
• Key Entities: Target: Embedd (Embedd Limited); Lead Investor: Seedcamp; Participating Investors: Cocoa, Connect Ventures, 2100 Ventures, Vesna Capital, U.ventures, Underline Ventures, Common Magic, and Roosh Ventures; Key Founders: Michael Lazarenko (CEO), Maxim Gorinov (CTO), Valentin Gololobov.
• Location: London, UK (HQ).

Note: Founded by Ukrainian tech entrepreneurs Michael Lazarenko, Maxim Gorinov, and Valentin Gololobov, Embedd solves a massive, hidden software bottleneck in the physical AI and robotics boom. While billions of dollars have flooded into robotic hardware and spatial foundation models, intelligent machines rely on dozens of heterogeneous semiconductor chips from different manufacturers that cannot natively communicate with one another. Historically, embedded software engineers have had to manually read thousands of pages of dense PDF datasheets to hand-write low-level firmware drivers and board support packages for every new chip component. Embedd automates this entire low-level stack: its platform parses hardware documentation to generate an active digital twin of the chip, giving specialized AI agents the exact operational context to automatically write, verify, and test production-ready integration code. This allows hardware and IoT manufacturers to ship production-ready firmware up to 6x faster. Launched commercially in April 2026, Embedd has already locked in commercial contracts with tier-one semiconductor providers, including a flagship deployment with Microchip Technology enabling automated Zephyr RTOS support. This $2.7m pre-seed capital will fund core AI engineering hires and scale ongoing enterprise partnerships across the global semiconductor ecosystem.